Testing apparatus

ABSTRACT

A testing apparatus includes a chip carrying device and a pressing device. The chip carrying device includes a circuit board and a plurality of electrically connecting units that are disposed on the circuit board and each can receive a chip. The pressing device includes a cover and an abutting member disposed between the cover and the electrically connecting units. The cover is disposed on the circuit board to jointly define an accommodating space that accommodates the abutting member and the electrically connecting units. The cover can be connected to an air suction apparatus for expelling air in the accommodating space. When the air suction apparatus performs a suction operation to expel the air in the accommodating space, the abutting member is abutted against the electrically connecting units and the chips so as to connect each of the electrically connecting units and the corresponding chip.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application claims the benefit of priority to Taiwan PatentApplication No. 108115566, filed on May 6, 2019. The entire content ofthe above identified application is incorporated herein by reference.

Some references, which may include patents, patent applications andvarious publications, may be cited and discussed in the description ofthis disclosure. The citation and/or discussion of such references isprovided merely to clarify the description of the present disclosure andis not an admission that any such reference is “prior art” to thedisclosure described herein. All references cited and discussed in thisspecification are incorporated herein by reference in their entiretiesand to the same extent as if each reference was individuallyincorporated by reference.

FIELD OF THE DISCLOSURE

The present disclosure relates to a testing apparatus, and moreparticularly to a testing apparatus provided for testing a chip.

BACKGROUND OF THE DISCLOSURE

In a memory testing process of a conventional memory testing apparatus,memory chips are inserted one-by-one into electrical sockets formed on acircuit board by a human or a robotic arm, and then the conventionalmemory testing apparatus can be operated to test the memory chipsthrough the electrical sockets and the circuit board. However, inpractical use, if a good memory is not firmly connected to theelectrical socket (e.g., pins of the good memory chip are not connectedto pins of the electrical socket), the good memory chip may beclassified as a defective memory chip.

SUMMARY OF THE DISCLOSURE

In response to the above-referenced technical inadequacies, the presentdisclosure provides a testing apparatus to effectively improve theissues associated with conventional memory testing apparatus (e.g.,memory chips are inserted into electrical sockets by a human or arobotic arm, so as to easily result in an unstable connection betweenthe memory chips and the electrical sockets, causing an incorrecttesting result).

In one aspect, the present disclosure provides a testing apparatus fortesting a plurality of chips. The testing apparatus includes a chipcarrying device and a pressing device. The chip carrying device includesat least one circuit board and a plurality of electrically connectingunits disposed on the at least one circuit board for carrying the chips.The pressing device includes a cover and an abutting member. The coverhas a concavity formed on one side thereof. The cover is disposed on theat least one circuit board so as to jointly define an accommodatingspace, and the electrically connecting units are arranged in theaccommodating space. The cover is configured to be connected to an airsuction apparatus for expelling air in the accommodating space so as tocause the accommodating space to be under a negative pressure. Theabutting member is disposed between the cover and the electricallyconnecting units and is at least partially arranged in the accommodatingspace. When the air suction apparatus performs a suction operation toexpel the air in the accommodating space so as to cause theaccommodating space to be under a predetermined pressure, the abuttingmember is abutted against the electrically connecting units and thechips so as to connect each of the electrically connecting units and thecorresponding chip.

Therefore, the testing apparatus of the present disclosure can beprovided to cooperate with an external air suction apparatus that canperform a suction operation to expel air in the accommodating space tocause the accommodating space to be under a negative pressure, so thatthe abutting member can tightly press the chips disposed on theelectrically connecting units for ensuring each of the chips to betightly connected to the corresponding electrically connecting unit.

These and other aspects of the present disclosure will become apparentfrom the following description of the embodiment taken in conjunctionwith the following drawings and their captions, although variations andmodifications therein may be affected without departing from the spiritand scope of the novel concepts of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more fully understood from thefollowing detailed description and accompanying drawings.

FIG. 1 is a perspective view of a testing apparatus according to thepresent disclosure.

FIG. 2 is an exploded view of the testing apparatus according to thepresent disclosure.

FIG. 3 is an enlarged view showing an electrically connecting unitdisposed on a circuit board according to the present disclosure.

FIG. 4 is a cross-sectional and exploded view of the electricallyconnecting unit according to the present disclosure.

FIG. 5 is a cross-sectional view taken along line V-V of FIG. 3.

FIG. 6 is a cross-sectional view taken along line VI-VI of FIG. 3.

FIG. 7 is an enlarged view showing the electrically connecting unitreceiving a chip according to the present disclosure.

FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 7.

FIG. 9 is a cross-sectional view showing the electrically connectingunit receiving the chip and pressed by a pressing device according tothe present disclosure.

FIG. 10 is an exploded view of a probe assembly of the electricallyconnecting unit according to the present disclosure.

FIG. 11 is an exploded view showing the pressing device according to thepresent disclosure.

FIG. 12 is an exploded view showing the pressing device from anotherangle of view according to the present disclosure.

FIG. 13 is a cross-sectional view taken along line XIII-XIII of FIG. 1.

FIG. 14 is a cross-sectional view of the testing apparatus in anotherconfiguration.

FIG. 15 is a cross-sectional view showing the pressing device in anotherconfiguration and the chip carrying device.

FIG. 16 is a cross-sectional view showing the pressing device in stillanother configuration and the chip carrying device.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

The present disclosure is more particularly described in the followingexamples that are intended as illustrative only since numerousmodifications and variations therein will be apparent to those skilledin the art. Like numbers in the drawings indicate like componentsthroughout the views. As used in the description herein and throughoutthe claims that follow, unless the context clearly dictates otherwise,the meaning of “a”, “an”, and “the” includes plural reference, and themeaning of “in” includes “in” and “on”. Titles or subtitles can be usedherein for the convenience of a reader, which shall have no influence onthe scope of the present disclosure.

The terms used herein generally have their ordinary meanings in the art.In the case of conflict, the present document, including any definitionsgiven herein, will prevail. The same thing can be expressed in more thanone way. Alternative language and synonyms can be used for any term(s)discussed herein, and no special significance is to be placed uponwhether a term is elaborated or discussed herein. A recital of one ormore synonyms does not exclude the use of other synonyms. The use ofexamples anywhere in this specification including examples of any termsis illustrative only, and in no way limits the scope and meaning of thepresent disclosure or of any exemplified term. Likewise, the presentdisclosure is not limited to various embodiments given herein. Numberingterms such as “first”, “second” or “third” can be used to describevarious components, signals or the like, which are for distinguishingone component/signal from another one only, and are not intended to, norshould be construed to impose any substantive limitations on thecomponents, signals or the like.

Referring to FIG. 1 and FIG. 2, a testing apparatus E in an assembledstate and in an exploded state according to an embodiment of the presentdisclosure are shown. The testing apparatus E includes a chip carryingdevice El and a pressing device E2.

The chip carrying device E1 includes a circuit board 1 and a pluralityof electrically connecting units 2 mounted on the circuit board 1. Inother words, each of the electrically connecting units 2 in the presentembodiment can be referred to an electrical socket. Each of theelectrically connecting units 2 is configured to carry a chip C (shownin FIG. 7), and includes a plurality of probe assemblies 20 (shown inFIG. 4). One end of each of the probe assemblies 20 is connected to thecircuit board 1, and the other end of each of the probe assemblies 20 isconnected to the chip C. In other words, the probe assemblies 20 areconfigured to electrically connect the circuit board 1 and the chip C.In other embodiments of the present disclosure, the number of thecircuit board 1 of the chip carrying device E1 can be more than one. Thechip C is preferably a NAND flash memory, but is not limited to amemory.

Moreover, the circuit board 1 can be provided with at least onecontrolling unit (not shown, such as a microprocessor) or a controllingapparatus (not shown, such as a computer), so that the at least onecontrolling unit or the controlling apparatus can be electricallyconnected to the chips C through the circuit board 1 for further testingthe chips C. The testing process of the at least one controlling unit orthe controlling apparatus can be changed or adjusted according topractical requirements or modes of the chips C. The at least onecontrolling unit or the controlling apparatus can simultaneously testall of the chips C disposed on the circuit board 1 by the same testingprocess, or can test the chips C respectively disposed on differentregions of the circuit board 1 by different testing processes, but thepresent disclosure is not limited thereto.

The pressing device E2 can be manipulated to press a side of each of theelectrically connecting units 2 receiving the chip C, so that when thechips C are under a testing process, each of the chips C can be firmlyconnected to the probe assemblies 20 of the corresponding electricallyconnecting unit 2. In other embodiments of the present disclosure, thepressing device E2 can be used to change the temperature of each of thechips C, so that the chips C can be tested under a high temperature or alow temperature

FIG. 3 is an enlarged view showing one of the electrically connectingunits 2 disposed on the circuit board 1 according to the presentdisclosure. FIG. 4 is a cross-sectional and exploded view of one of theelectrically connecting units 2 according to the present disclosure.FIG. 5 is a cross-sectional view taken along line V-V of FIG. 3. FIG. 6is a cross-sectional view taken along line VI-VI of FIG. 3. As shown inFIG. 3 to FIG. 6, each of the electrically connecting units 2 includes aplurality of probe assemblies 20, a main body 21, a lift structure 22, asupporting structure 23, and four elastic assemblies 24.

The main body 21 has a top wall 211 and an annular wall 212. The topwall 211 has an opening 21A. One end of the annular wall 212 isconnected to a peripheral edge of the top wall 211, and the other end ofthe annular wall 212 is disposed and fixed on the circuit board 1. Thetop wall 211, the annular wall 212, and the circuit board 1 jointlydefine an accommodating slot 21B. The top wall 211 has an inner surface2111 arranged in the accommodating slot 21B and an outer surface 2112opposite to the inner surface 2111. As shown in FIG. 3, the top wall 211and the annular wall 212 can be integrally formed as a one-piecestructure, and the main body 21 has a plurality of screwing holes 21Cfor being cooperated with screwing members (e.g., screws) so as to fixthe main body 21 onto the circuit board 1, but the present disclosure isnot limited thereto.

The lift structure 22 includes a base portion 221 and a carrying portion222. The base portion 221 is entirely arranged in the accommodating slot21B. The carrying portion 222 is formed by extending from the baseportion 221, and is partially arranged in the opening 21A. The liftstructure 22 includes four retaining portions 223 extending from thecarrying portion 222 along a direction away from the base portion 221.The four retaining portions 223 can be respectively formed on fourcorners of the carrying portion 222. The four retaining portions 223 andthe carrying portion 222 jointly form a chip receiving slot 22B foraccommodating one of the chips C. The four retaining portions 223 areconfigured to engage with the chip C. Each of the four retainingportions 223 can substantially be an L-shape structure, but the presentdisclosure is not limited thereto. The number of the retaining portions223 can be changed according to design requirements, and is not limitedto four. Moreover, the position of the retaining portions 223 is notlimited to the drawings; that is to say, the four retaining portions 223can be formed on a part of the carrying portion 222 other than the fourcorners. The lift structure 22 further has a plurality of connectingholes 22A (shown in FIG. 6) penetratingly formed through the baseportion 221 and the carrying portion 222.

Each of the probe assemblies 20 is partially fixed in the supportingstructure 23. One end of each of the probe assemblies 20 fixed in thesupporting structure 23, which is defined as a first end, is connectedto the circuit board 1. The other end of each of the probe assemblies 20is defined as a second end, and the second ends of the probe assemblies20 are respectively arranged in the connecting holes 22A. The secondends of the probe assemblies 20 arranged in the connecting holes 22A areconfigured to respectively connect with a plurality of contacts C2 ofthe chip C.

As shown in FIG. 4 to FIG. 6, the supporting structure 23 is arranged inthe accommodating slot 21B, and the four elastic assemblies 24 aredisposed between the supporting structure 23 and the lift structure 22.Each of the four elastic assemblies 24 can be a compression spring. Thesupporting structure 23 and the lift structure 22 have a plurality ofengaging slots 22C, 23A recessed in surfaces thereof facing each other,and the engaging slots 22C respectively correspond in position to theengaging slots 23A. Two end portions of each of the four elasticassemblies 24 are respectively engaged within two of the engaging slots22C, 23A corresponding in position to each other. In other embodimentsof the present disclosure, the supporting structure 23 and the liftstructure 22 have a plurality of posts respectively in the engagingslots 22C, 23A, and the two end portions of each of the elasticassemblies 24 are respectively engaged with two of the posts in the twocorresponding engaging slots 22C, 23A.

The four elastic assemblies 24 are configured to push the base portion221 of the lift structure 22 to abut against the inner surface 2112 ofthe top wall 211, so that the base portion 221 and the supportingstructure 23 have a gap S therebetween (shown in FIG. 6). Specifically,when the electrically connecting unit 2 is fixed to the circuit board 1and the retaining portions 223 are not pressed by an external force, thefour elastic assemblies 24 between the lift structure 22 and thesupporting structure 23 can be slightly compressed to generate a returnforce that pushes the lift structure 22 to firmly abut against the innersurface 2112 of the top wall 211.

It should be noted that the number of the elastic assemblies 24 of theelastically connecting unit 2 is not limited to four and can be changedaccording to design requirements (e.g., can be at least one).

As shown in FIG. 7 and FIG. 8, when the chip receiving slot 22B receivesthe corresponding chip C and the retaining portions 223 are not pressedby the pressing device E2 (shown in FIG. 2), the contacts C2 of the chipC are respectively arranged in the connecting holes 22A, and the probeassemblies 20 are not connected to (e.g., do not touch) the contacts C2of the chip C, and the gap S exists between the lift structure 22 andthe supporting structure 23. As shown in FIG. 8, an outer surface C2 ofthe chip C arranged away from the lift structure 22 cannot protrude fromthe retaining portions 223, but the present disclosure is not limitedthereto. In other embodiments of the present disclosure, the outersurface C2 of the chip C can be substantially coplanar with or slightlyprotrude from an outer surface 223A of each of the retaining portions223. It should be noted that the contacts C1 shown in the drawings ofthe present embodiment are solder balls, but the contacts C1 can bechanged according to design requirements (e.g., pins or pads).

As shown in FIG. 9, when the chip receiving slot 22B receives thecorresponding chip C and the outer surface 2111 of the top wall 211 ispressed by the pressing device E2, the retaining portions 223 arepressed by the pressing device E2 so as to move toward the accommodatingslot 21B (or an inner side of the main body 21). That is to say, thelift structure 22 is moved toward the circuit board 1 relative to theprobe assemblies 20.

When the retaining portions 223 are pressed by the pressing device E2 soas to move toward the accommodating slot 21B, the lift structure 22 ismoved relative to the probe assemblies 20. When the lift structure 22 isabutted against the supporting structure 23, the second ends of theprobe assemblies 20 protrude from the connecting holes 22A and areabutted against the contacts C1 of the chip C for establishing anelectrical connection between the probe assemblies 20 and the chip C. Itshould be noted that if the lift structure 22 is abutted against thesupporting structure 23 and the probe assemblies 20 are connected to thechip C, the probe assemblies 20 cannot protrude from the connectingholes 22A. In the drawings of the present embodiment, after the liftstructure 22 is pressed, the retaining portions 223 can be entirelyreceived in the accommodating slot 21B (or the main body 21), but thepresent disclosure is not limited thereto. In other embodiments of thepresent disclosure, after the lift structure 22 is pressed, each of theretaining portions 223 can be partially received in the accommodatingslot 21B (or the main body 21).

When the pressing device E2 is abutted against the outer surface 2111 ofthe electrically connecting unit 2, the probe assemblies 20 can push thechip C to cause the outer surface C2 of the chip C to abut against aninner side of the pressing device E2. Moreover, when the outer surfaceC2 of the chip C is abutted against the inner side of the pressingdevice E2, a spring 202 of each of the probe assemblies 20 is compressedto generate a return force that causes the chip C to firmly abut againstthe inner surface 2112 of the pressing device E2.

As shown in FIG. 6, a longitudinal direction of each of the probeassemblies 20 can define an axis direction (i.e., a Y axis shown in FIG.6). When the lift structure 22 is not pressed (and the base portion 221can be abutted against the top wall 2111), a distance D2 between thesecond end of each of the probe assemblies 20 and an adjacent edge ofthe corresponding connecting hole 22A is less than or equal to adistance D1 between the lift structure 22 and the supporting structure23 in the axis direction. Accordingly, when the lift structure 22 ispressed to abut against the supporting structure 23 (shown in FIG. 9),the second ends of the probe assemblies 20 can be ensured to protrudefrom the connecting holes 22A so as to be connected to the contacts C1of the chip C.

It should be noted that as long as the connection between the probeassemblies 20 and the contacts C1 of the chip C can be established afterthe lift structure 22 is pressed, the distance D1 and the distance D2can be adjusted according to design requirements. In other words, whenthe lift structure 22 is pressed, if the connection between the probeassemblies 20 and the contacts C1 of the chip C can be established, eachof the probe assemblies 20 can protrude from or can be received in thecorresponding connecting hole 22A.

As shown in FIG. 6, when the retaining portions 223 are not pressed, aportion of each of the retaining portions 223 protruding from theopening 21A (or the main body 21) has a length H1 in the axis direction(i.e., the Y axis shown in FIG. 6), and the length H1 is less than orequal to a distance D1 between the lift structure 22 and the supportingstructure 23 in the axis direction. Accordingly, each of the retainingportions 223 can be pressed by the pressing device E2 so as to move intothe accommodating slot 21B (or the main body 21). If the length H1 isequal to the distance D1, when the pressing device E2 is abutted againstthe outer surface 2111 of the main body 21, the lift structure 22 willbe abutted against the supporting structure 23.

Moreover, when the pressing device E2 is abutted against the outersurface 2111 of the electrically connecting unit 2, the probe assemblies20 are abutted against the chip C to cause the chip C to abut againstthe pressing device E2, and the pressing device E2 can be controlled toincrease or decrease temperature thereof so as to test the chips C at ahigh temperature or a low temperature.

The pressing device E2 can be simultaneously attached onto the outersurfaces C2 of the chips C by abutting against the outer surfaces 2111of the electrically connecting units 2, so that when the pressing deviceE2 is controlled to increase or decrease the temperature thereof,temperatures of the chips C are changed by the pressing device E2 so asto be almost the same. Accordingly, the chips C can be ensured to betested under the same temperature.

In prior art, the chips C may be tested in a high temperatureenvironment by the following manner. A circuit board and the chips Cinserted to the circuit board are disposed in an oven, and a hot airblower in the oven is used to increase an inner temperature of the oven,so that the chips C can be tested in a high temperature environment.However, the above testing manner of the prior art cannot accuratelycontrol the temperature of each region of the oven, so that the chips Ccannot be tested in a predetermined temperature environment, causing thetesting result to be incorrect. The testing apparatus E of the presentdisclosure can effectively improve the issues associated with the abovetesting manner of the prior art.

As shown in FIG. 4, FIG. 6, FIG. 8 and FIG. 9, the supporting structure23 can include a seat structure 231 and an auxiliary structure 232. Theseat structure 231 is arranged in the accommodating slot 21B, and isfixed with the main body 21 (e.g., the seat structure 231 and the mainbody 21 are fixed to each other by screws). The seat structure 231 has aplurality of thru-holes 231A, and the first ends of the probe assemblies20 are fixed in the thru-holes 231A.

In addition, since one of the main functions of the seat structure 231is maintaining the probe assemblies 20 to be firmly and uprightlyarranged in the accommodating slot 21B, a diameter of each of thethru-holes 231A of the seat structure 231 can be slightly greater than amaximum diameter of each of the probe assemblies 20, and each of theprobe assemblies 20 is movably arranged in the corresponding thru-hole231A. In the seat structure 231, the number of the thru-holes 231A, adepth of each of the thru-holes 231A, a distance between any twoadjacent thru-holes 231A, and the arrangement of the thru-holes 231A canbe adjusted or changed according to design requirements, and are notlimited to the present embodiment.

The auxiliary structure 232 is arranged in the accommodating slot 21Band between the seat structure 231 and the top wall 211, and theauxiliary structure 232 and the seat structure 231 are fixed to eachother (e.g., by screws). The auxiliary structure 232 has a plurality ofsupporting holes 232A spaced apart from each other. The supporting holes232A of the auxiliary structure 232 are respectively in spatialcommunication with the thru-holes 231A of the seat structure 231, andrespectively correspond in position to the connecting holes 22A. Theconnecting holes 22A, the supporting holes 232A, and the thru-holes 231Ajointly define a plurality of probe channels T, and the probe assemblies20 are respectively arranged in the probe channels T.

FIG. 10 is an exploded view of one of probe assemblies 20. As shown inFIG. 10, the probe assembly 20 includes a pin 201 and a spring 202. Thepin 201 is a rod structure, and has a contacting end 201A and a tail end201B both arranged on two opposite ends thereof. The pin 201 has aprotrusion 2011 arranged adjacent to the contacting end 201A, and theprotrusion 2011 in the present embodiment is an annular structure, butthe present disclosure is not limited thereto. The pin 201 can bedefined as an exposed segment 201C and a received segment 201D by theprotrusion 2011. The received segment 201D of the pin 201 is insertedinto the spring 202, and the exposed segment 201C is arranged outside ofthe spring 202.

The received segment 201D of the pin 201 has a fixing segment 201Earranged adjacent to the protrusion 2011. A diameter of the fixingsegment 201E is larger than that of the other portions of the receivedsegment 201D.

The spring 202 sequentially includes a first close segment 202A, anelastic segment 202B, and a second close segment 202C. An inner diameterof the first close segment 202A is less than the diameter of the fixingsegment 201E. When the received segment 201D of the pin 201 is insertedinto the spring 202, the fixing segment 201E and the first close segment202A are engaged with each other, a distal end of the spring 202arranged adjacent to the first close segment 202A is abutted against aside of the protrusion 2011. In other words, the inner diameter of thefirst close segment 202A of the spring 202 and the diameter of thefixing segment 201E of the pin 201 are designed to be cooperated witheach other, so that an end portion of the spring 202 can be fixed ontothe fixing segment 201E of the pin 201.

Each of the first close segment 202A and the second close segment 202Chas a pitch less than a pitch of the elastic segment 202B. Moreover, thepitch of the first close segment 202A or the second close segment 202Ccan be approached to zero, so that if the spring 202 is pressed, thefirst close segment 202A and the second close segment 202C are notdeformed. Accordingly, the first close segment 202A and the second closesegment 202C of the spring 202 are formed to fix to the pin 201 and theseat structure 231.

A length of the first close segment 202A of the spring 202 is less thanthat of the elastic segment 202B, and a length of the second closesegment 202C is determined according to the depth of each of thethru-holes 231A of the seat structure 231.

The spring 202 of each of the probe assemblies 20 in the presentembodiment is an electrically conductive material. When the spring 202is sleeved around the pin 201 and the first close segment 202A is fixedto the fixing segment 201E, the tail end 201B of the pin 201 can bereceived in the spring 201, so that a distal end of the second closesegment 202C of the spring 202 can be structurally and electricallyconnected to the circuit board 1. Accordingly, the current and signaltransmission between the circuit board 1 and the chip C can be achievedby the pin 201 and the spring 202.

As shown in FIG. 6 and FIG. 10, the auxiliary structure 232 includes aplurality of abutting portions 2321 respectively arranged in thesupporting holes 232A. The abutting portions 2321 are configured torespectively abut against the protrusions 2011 of the pins 201. When theprobe assembly 20 is arranged in the probe channel T, the protrusion2011 of the pin 201 is abutted against the abutting portion 2321, andthe abutting portion 2321 is formed to prevent the pin 201 from movingtoward the lift structure 22 relative to the auxiliary structure 232.Since the protrusion 2011 of the pin 201 is abutted against the abuttingportion 2321, the received segment 201D of the pin 201 is arranged inthe seat structure 231 and the auxiliary structure 232 (or is arrangedin the supporting structure 23), most of the exposed segment 201C of thepin 201 is arranged outside of the supporting structure 23, and aportion of the pin 201 close to the contacting end 201A is arranged inthe connecting hole 22A.

As shown in FIG. 3 and FIG. 6, each of the electrically connecting units2 can be fixed onto the circuit board 1 in a screwing manner, and (thefirst end of) each of the probe assemblies 20 can be abutted against thecircuit board 1; that is to say, the connection between the probeassemblies 20 and the circuit board 1 can be achieved without using asoldering manner. Accordingly, any of the electrically connecting units2 or any of the probe assemblies 20 can be replaced according topractical requirements.

As shown in FIG. 8 and FIG. 9, when the pressing device E2 is separatedfrom the retaining portions 223, the return force generated from each ofthe elastic assemblies 24 will move the lift structure 22 from aposition adjacent to the auxiliary structure 232 toward the top wall 211so as to abut against the inner surface 2112. When the lift structure 22is moved from a position shown in FIG. 10 to a position shown in FIG. 8,the movement of the lift structure 22 causes the chip C to be separatedfrom the contacting ends 201A of the pins 201, so that the chip C is notelectrically connected to the probe assemblies 20. In other words, thechip C is not connected to the probe assemblies 20.

As shown in FIG. 6 and FIG. 10, under the limitation about the length H1less than the distance D1 is satisfied, when the pressing device E2 isabutted against the outer surface 2111, the lift structure 22 and theauxiliary structure 23 will have a gap G there-between. According, ifthe lift structure 22 or the auxiliary structure 232 has a productionerror, the pressing device E2 can be ensured to abut against the outersurface 2111 by the gap G.

In other embodiments of the present disclosure, when the pressing deviceE2 presses the lift structure 22 and the probe assemblies 20 areconnected to the contacts C2 of the chip C, the pressing device E2cannot press the outer surface 2111, but the lift structure 22 isabutted against the supporting structure 23. In other words, when thechip C is arranged in the chip receiving slot 22B of the electricallyconnecting unit 2 and the lift structure 22 is not pressed, the probeassemblies 20 are not connected to the chip C. When the lift structure22 is pressed to move into the main body 21, the probe assemblies 20 areabutted against the chip C for establishing an electrical connectionthere-between. When the lift structure 22 is no longer pressed, the liftstructure 22 returns to an original state, and the chip C is notconnected to the probe assemblies 20.

FIG. 11 and FIG. 12 are exploded views showing the pressing device E2 ofthe testing apparatus E according to one of the embodiments of thepresent disclosure. FIG. 13 is a cross-sectional view showing thepressing device E2 abutted against the electrically connecting units 2.As shown in FIG. 11 to FIG. 13, the pressing device E2 can include atemperature adjusting assembly 30 and an exhaust assembly 40. The numberof the temperature adjusting assembly 30 can be changed according todesign requirements, and is not limited to one.

The temperature adjusting assembly 30 can include a temperatureconditioner 31 and a lid 32. The temperature conditioner 31 includes aflat structure 311 arranged on one side thereof, and the flat structure311 has a flat contacting surface 3111. The temperature conditioner 31can have heating coils (not shown) arranged inside thereof for beingheated to generate heat energy. The temperature conditioner 31 has atleast one fluid channel (not shown) arranged inside thereof, a fluidentrance 31A, and a fluid exit 31B. The fluid entrance 31A and the fluidexit 31B are in spatial communication with the fluid channelSpecifically, a fluid having low temperature can flow into the fluidchannel through the fluid entrance 31A, and then can flow out of thefluid channel from the fluid exit 31B. In addition, a flat portion ofthe pressing device E2 shown in FIG. 9 can be regarded as the flatstructure 311 of the temperature adjusting assembly 30. The number ofthe fluid entrance 31A or the number of the fluid exit 31B can be addedaccording to design requirements, and is not limited to one. Moreover,the number of the temperature conditioner 31 is also not limited to one.In other embodiments of the present disclosure, the number of thetemperature conditioner 31 can be at least two.

As shown in FIG. 12 and FIG. 9, when the pressing device E2 presses theelectrically connecting units 2, the flat structure 311 of the pressingdevice E2 is abutted against the outer surface 2111 of each of theelectrically connecting units 2 and the outer surface C2 of each of thechips C. At the same time, the temperature conditioner 31 can becontrolled by a controlling unit or a controlling apparatus to heat theheating coils thereof so as to increase the temperature of the flatstructure 311. Accordingly, the chip C can be tested under a hightemperature. Moreover, a fluid storage apparatus (not shown) connectedto the temperature conditioner 31 can be controlled by the controllingunit or the controlling apparatus to output a fluid having lowtemperature into the temperature conditioner 31 through the fluidentrance 31A so as to decrease the temperature of the flat structure311. Accordingly, the chip C can be tested under a low temperature.

In addition, the pressing device E2 can include the heating coils, butexclude the fluid channel. Or, the pressing device E2 can include thefluid channel, but exclude the heating coils. Accordingly, the pressingdevice E2 is not limited to have a heating function and a coolingfunction. In other words, the pressing device E2 can be provided with atleast one of the heating function and the cooling function. In otherembodiments of the present disclosure, if the pressing device E2 onlyincludes the fluid channel (i.e., excludes the heating coils), the fluidchannel can be used to receive a fluid having a high temperature, sothat the pressing device E2 still has the heating function.

The temperature adjusting assembly 30 disclosed in the above descriptionis only one of the embodiments, but the present disclosure is notlimited thereto. For example, the temperature adjusting assembly 30 caninclude a cooling chip.

The lid 32 is disposed and fixed on a side of the temperatureconditioner 31, and is configured to block transmission of heat energy.Accordingly, the rapid dissipation of the heat energy generated from thetemperature conditioner 31 can be avoided, or transmission of heatenergy from an external side into the temperature conditioner 31 thatprovides the fluid having low temperature to flow there-through can beavoided. In practical use, the lid 32 and the temperature conditioner 31can jointly form an accommodating space 32A therein that can be filledwith any member for blocking transmission of heat energy. The shape andsize of the temperature conditioner 31 or the lid 32 shown in thedrawings is one of the embodiments, and can be changed according todesign requirements. In addition, the temperature conditioner 31 is notlimited to heat the heating coils to generate heat energy, and is notlimited to use a fluid having low temperature to decrease temperature.

The exhaust assembly 40 includes a cover 401 having a concavity 40Aformed on one side thereof. The cover 401 has an accommodating opening40B in spatial communication with the concavity 40A. The temperatureconditioner 31 includes a protruding portion 312 extending from a sideof the flat structure 311 opposite to the flat contacting surface 3111.The flat structure 311 is arranged and fixed in the concavity 40A, andthe protruding portion 312 passes through the accommodating opening 40B.The fluid entrance 31A and the fluid exit 31B are formed on theprotruding portion 312, but can be changed according to designrequirements. The lid 32 is arranged at one side of the cover 401 thatis opposite to the concavity 40A. The cover 401 further has two exhaustholes 40C for being connected to an air suction apparatus. The size andshape of the cover 401 or the number and size of the exhaust holes 40Ccan be adjusted or changed according to design requirements.

As shown in FIG. 13 and FIG. 9, when the pressing device E2 is locatedat one side of the circuit board 1, the flat structure 311 of thetemperature conditioner 31 is abutted against the retaining portions 223of the electrically connecting units 2. In the meantime, the cover 401,the circuit board 1, and the flat structure 311 jointly form anaccommodating space SP that is in spatial communication with the twoexhaust holes 40C, so that the air suction apparatus can perform asuction operation to expel air in the accommodating space SP so as tocause the accommodating space SP to be under a negative pressure,causing the flat structure 311 to easily abut against the retainingportions 223 of the electrically connecting units 2 mounted on thecircuit board 1.

Specifically, when the pressing device E2 presses the retaining portions223, the pressing device E2 needs to resist the return forces generatedfrom the elastic assemblies 24 and the probe assemblies 20. Accordingly,when the number of the electrically connecting units 2 mounted on thecircuit board 1 is increased, a pressing force of the pressing device E2simultaneously applied to the retaining portions 223 of the electricallyconnecting units 2 needs to be increased. In the above condition, thepressing device E2 can be cooperated with the air suction apparatus tocause the accommodating space SP to be under the negative pressure,thereby effectively reducing the pressing force of the pressing deviceE2 simultaneously applied to the retaining portions 223.

Since the pressing device E2 is cooperated with the air suctionapparatus to cause the accommodating space SP to be under the negativepressure, the accommodating space SP can be in a substantial vacuummode. Accordingly, when the temperature conditioner 31 is operated toincrease or decrease the temperature of the chips C, the temperature ofthe accommodating space SP can effectively avoid being affected by anexternal environment.

As shown in FIG. 2 and FIG. 13, the exhaust assembly 40 can include anairtight member 50 and a structural reinforcement member 60. Theairtight member 50 can be an annular structure, and is sandwichedbetween the cover 401 and the circuit board 1 so as to prevent theaccommodating space SP from being in air communication with an externalspace. In practical use, the airtight member 50 can be engaged with thecover 401 or the circuit board 1, but the present disclosure is notlimited thereto. Moreover, the shape, size, or position of the airtightmember 50 can be adjusted or changed according to design requirements.It should be noted that any airtight components can be added to bedisposed at positions that may affect the air tightness of theaccommodating space SP. For example, as shown in FIG. 3, each of thescrewing holes 21C can be provided with a resilient gasket arrangedtherein or an adhesive filled therein, thereby improving the airtightness between the screwing holes 21C and the screwing members.

The structural reinforcement member 60 has an engaging slot 60A recessedin a side thereof, and the circuit board 1 is engaged with the engagingslot 60A. The structural reinforcement member 60 is configured toreinforce the structural strength of the circuit board 1, therebypreventing the circuit board 1 from being deformed in an air suctionprocess of the accommodating space SP. Moreover, excepting the engagingconnection between the structural reinforcement member 60 and thecircuit board 1, the circuit board 1 and the structural reinforcementmember 60 can be further fixed to each other by using screwing members(e.g., screws), and can be provided with a sealing gasket, a solderingconnection, or a sealing adhesive there-between, thereby sealing gapsbetween the circuit board 1 and the screwing members.

In other embodiments of the present disclosure, the number or positionof the structural reinforcement member 60 can be adjusted according todesign requirements. For example, the number of the structuralreinforcement member 60 of the testing apparatus E can be two, and thecircuit board 1 is sandwiched between the two structural reinforcementmembers 60.

FIG. 14 is a cross-sectional view of the testing apparatus in anotherconfiguration. The difference between the testing apparatus E shown inFIG. 14 and shown in FIG. 13 is described as follows. As shown in FIG.14, the testing apparatus E can be provided without the airtight member50, and the cover 401 can be direct abutted against the circuit board 1.In addition, the cover 401 and the circuit board 1 can be formed withengaging structures for engaging with each other.

FIG. 15 is a cross-sectional view showing the testing apparatus E inanother configuration and the chip carrying device E1. The differencebetween the testing apparatus E shown in FIG. 15 and shown in FIG. 14 isdescribed as follows. As shown in FIG. 15, the pressing device E2 caninclude the exhaust assembly 40, but excludes the temperature adjustingassembly 30. The exhaust assembly 40 has a cover 401A. The cover 401Ahas a concavity 40A recessed in one side thereof, but does not have theaccommodating opening 40B. In addition, the pressing device E2 furtherincludes an abutting member 70.

The cover 401A is disposed on the circuit board 1 so as to jointlydefine an accommodating space SP. The cover 401A has at least oneexhaust hole 40C (shown in FIG. 12) for providing an air suctionapparatus to perform a suction operation to expel air in theaccommodating space SP. The abutting member 70 can be detachably fixedto the cover 401A, and is arranged in the concavity 40A. Moreover, inother embodiments of the present disclosure, the abutting member 70 canbe fixed to the cover 401A by an undetachable manner (e.g., an adheringmanner).

The cover 401A can be fixed on the circuit board 1 by a plurality ofscrewing members (e.g., screws). When the cover 401A is disposed on thecircuit board 1, the abutting member 70 is disposed between the cover401A and the electrically connecting units 2, and the abutting member 70is abutted against the chips C disposed on the electrically connectingunits 2 (shown in FIG. 9). When the cover 401A is fixed onto the circuitboard 1 and the air suction apparatus performs a suction operation toexpel the air in the accommodating space SP to cause the accommodatingspace SP to be under a predetermined pressure (e.g., a negativepressure), the abutting member 70 simultaneously presses the retainingportions 223 of the electrically connecting units 2 so as to move theretaining portions 223 into the main body 21, and the abutting member 70is abutted against outer surfaces C2 of the chips arranged away from theelectrically connecting units 2 for establishing an electricalconnection between the probe assemblies 20 of each of the electricallyconnecting units 2 and the corresponding chip C. As shown in FIG. 16,the cover 401B can be integrally formed with the abutting member 70, andthe cover 401B and the abutting member 70 are not respectively limitedto two independent components.

In conclusion, the testing apparatus of the present disclosure can usethe pressing device to simultaneously press the chips fastened to theelectrically connecting units, so that the chips can be tested under asame temperature. Moreover, when the chip is tested by the testingapparatus of the present disclosure, the electrically connecting unitcan be used to firmly connect the chip and the probe assemblies by thecooperation of the lift structure, the elastic assembly, and the probeassemblies.

The foregoing description of the exemplary embodiments of the disclosurehas been presented only for the purposes of illustration and descriptionand is not intended to be exhaustive or to limit the disclosure to theprecise forms disclosed. Many modifications and variations are possiblein light of the above teaching.

The embodiments were chosen and described in order to explain theprinciples of the disclosure and their practical application so as toenable others skilled in the art to utilize the disclosure and variousembodiments and with various modifications as are suited to theparticular use contemplated. Alternative embodiments will becomeapparent to those skilled in the art to which the present disclosurepertains without departing from its spirit and scope.

What is claimed is:
 1. A testing apparatus for testing a plurality ofchips, comprising: a chip carrying device including: at least onecircuit board; and a plurality of electrically connecting units disposedon the at least one circuit board for carrying the chips; and a pressingdevice including: a cover having a concavity formed on one side thereof,wherein the cover is disposed on the at least one circuit board so as tojointly define an accommodating space, and the electrically connectingunits are arranged in the accommodating space, and wherein the cover isconfigured to be connected to an air suction apparatus for expelling theair in the accommodating space so as to cause the accommodating space tobe under a negative pressure; and an abutting member disposed betweenthe cover and the electrically connecting units and at least partiallyarranged in the accommodating space; wherein when the air suctionapparatus performs a suction operation to expel the air in theaccommodating space so as to cause the accommodating space to be under apredetermined pressure, the abutting member is abutted against theelectrically connecting units and the chips so as to connect each of theelectrically connecting units and the corresponding chip.
 2. The testingapparatus according to claim 1, wherein the cover or the at least onecircuit board has at least one exhaust hole for providing the airsuction apparatus to perform a suction operation to expel the air in theaccommodating space.
 3. The testing apparatus according to claim 1,wherein each of the electrically connecting units includes: a main bodyhaving a top wall and an annular wall, wherein the top wall has anopening, one end of the annular wall is connected to a peripheral edgeof the top wall, and the other end of the annular wall is disposed onthe at least one circuit board, wherein the top wall, the annular wall,and the at least one circuit board jointly define an accommodating slot,and wherein the top wall has an inner surface arranged in theaccommodating slot and an outer surface opposite to the inner surface; asupporting structure disposed on the at least one circuit board andarranged in the accommodating slot; a lift structure arranged in theaccommodating slot and including a base portion, a carrying portionextending from the base portion, and a plurality of retaining portionsextending from the carrying portion along a direction away from the baseportion, wherein the base portion is arranged in the accommodating slot,and the carrying portion is at least partially arranged in the opening,wherein at least part of the retaining portions protrude from theopening of the main body, and the retaining portions and the carryingportion jointly form a chip receiving slot for accommodating one of thechips having a plurality of contacts, and wherein the lift structure hasa plurality of connecting holes penetratingly formed through the baseportion and the carrying portion; at least one elastic assembly arrangedin the accommodating slot, wherein one end of the at least one elasticassembly is fixed to the lift structure, and the other end of the atleast one elastic assembly is fixed to the supporting structure, andwherein the at least one elastic assembly is configured to be pressed togenerate a return force that pushes the base portion to abut against theinner surface of the top wall, so that the lift structure and thesupporting structure have a gap there-between; and a plurality of probeassemblies connected to the at least one circuit board and each having afirst end and an opposite second end, wherein the first ends of theprobe assemblies are fixed to the supporting structure, and the secondends of the probe assemblies are respectively arranged in the connectingholes, wherein in each of the electrically connecting units, when thechip receiving slot receives the corresponding chip and the retainingportions are not pressed by the abutting member, the probe assemblies inthe connecting holes are not connected to the contacts of thecorresponding chip, and wherein in each of the electrically connectingunits, when the chip receiving slot receives the corresponding chip andthe abutting member is abutted against the outer surface of the topwall, the retaining portions protruding from the opening of the mainbody are pressed by the pressing device so as to move toward theaccommodating slot, the probe assemblies are respectively abuttedagainst the contacts of the corresponding chip for establishing anelectrical connection between the probe assemblies and the correspondingchip.
 4. The testing apparatus according to claim 3, wherein in each ofthe electrically connecting units, a longitudinal direction of each ofthe probe assemblies defines an axis direction, and when the retainingportions are not pressed by the abutting member, a portion of each ofthe retaining portions protruding from the opening has a length in theaxis direction, and the length is less than or equal to a distancebetween the lift structure and the supporting structure in the axisdirection.
 5. The testing apparatus according to claim 3, wherein ineach of the electrically connecting units, a longitudinal direction ofeach of the probe assemblies defines an axis direction, and when thelift structure is not pressed by the abutting member, a distance betweenthe second end of each of the probe assemblies and an adjacent edge ofthe corresponding connecting hole is less than or equal to a distancebetween the lift structure and the supporting structure in the axisdirection.
 6. The testing apparatus according to claim 5, wherein ineach of the electrically connecting units, when the chip receiving slotreceives the corresponding chip, the abutting member is configured tosimultaneously press the outer surface of the top wall and an outersurface of the corresponding chip arranged away from the lift structure.7. The testing apparatus according to claim 4, wherein in each of theelectrically connecting units, when the chip receiving slot receives thecorresponding chip and the abutting member is abutted against the outersurface of the top wall, the second ends of the probe assembliesprotrude from the connecting holes.
 8. The testing apparatus accordingto claim 3, wherein in each of the electrically connecting units, whenthe chip receiving slot receives the corresponding chip and the abuttingmember presses the retaining portions to cause the lift structure toabut against the supporting structure, the probe assemblies arerespectively abutted against the contacts of the corresponding chip, andthe abutting member is abutted against an outer surface of thecorresponding chip arranged away from the lift structure.
 9. The testingapparatus according to claim 6, wherein in each of the electricallyconnecting units, when the chip receiving slot receives thecorresponding chip and the abutting member is abutted against the outersurface of the top wall, the second ends of the probe assembliesprotrude from the connecting holes.